I D25
t rr
PolarHT TM HiPerFET
Power MOSFET
ISOPLUS220 TM
(Electrically Isolated Back Surface)
IXFC 96N15P
V DSS = 150 V
= 42 A
R DS(on) = 26 m Ω
< 200 ns
N-Channel Enhancement Mode
Fast Recovery Diode, Avalanche Rated
ISOPLUS 220 TM
E153432
Symbol
Test Conditions
Maximum Ratings
V DSS
V DGR
T J = 25 ° C to 175 ° C
T J = 25 ° C to 175 ° C; R GS = 1 M Ω
150
150
V
V
V GS
V GSM
Continuous
Transient
± 20
± 30
V
V
G
D
S
Isolated back surface*
I D25
I DM
I AR
E AR
E AS
T C
T C
T C
T C
T C
= 25 ° C
= 25 ° C, pulse width limited by T JM
= 25 ° C
= 25 ° C
= 25 ° C
42
250
60
40
1.0
A
A
A
mJ
J
G = Gate
S = Source
D = Drain
dv/dt
P D
T J
T JM
T stg
T L
F C
V ISOL
Weight
I S ≤ I DM , di/dt ≤ 100 A/ μ s, V DD ≤ V DSS ,
T J ≤ 175 ° C, R G = 4 Ω
T C = 25 ° C
1.6 mm (0.062 in.) from case for 10 s
Mounting force
50/60 Hz, 1 minute
10
120
-55 ... +175
175
-55 ... +150
300
11...65/2.4...11
2500
3
V/ns
W
° C
° C
° C
° C
N/lb
~V
g
Features
Silicon chip on Direct-Copper-Bond
substrate
- High power dissipation
- Isolated mounting surface
- 2500V electrical isolation
Low drain to tab capacitance(<35pF)
Low R DS (on) HDMOS TM process
Rugged polysilicon gate cell structure
Unclamped Inductive Switching (UIS)
rated
Fast intrinsic Rectifier
Applications
DC-DC converters
Battery chargers
Symbol Test Conditions
(T J = 25 ° C, unless otherwise specified)
Characteristic Values
Min. Typ. Max.
Switched-mode and resonant-mode
power supplies
DC choppers
BV DSS
V GS = 0 V, I D = 250 μ A
150
V
AC motor control
V GS(th)
I GSS
I DSS
V DS = V GS , I D = 4 mA
V GS = ± 20 V DC , V DS = 0
V DS = V DSS
V GS = 0 V
T J = 150 ° C
3.0
5.0
± 100
25
300
V
nA
μ A
μ A
Advantages
Easy assembly: no screws, or isolation
foils required
Space savings
High power density
Low collector capacitance to ground
R DS(on)
V GS = 10 V, I D = 48 A, Note 1
Pulse test, t ≤ 300 μ s, duty cycle d ≤ 2 %
26
m Ω
(low EMI)
? 2006 IXYS All rights reserved
DS99240E(03/06)
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